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Showing results 4 to 6 of 6

Issue DateTitleAuthor(s)
2001-07New plasma display panel packaging technology using electrostatic bonding methodLee, DJ; Jeong, JW; Kim, YC; Lee, YH; Ju, BK; Cho, TS; Choi, EH; Jang, J
1999-01Novel bonding technology for hermetically sealed silicon micropackageLee, DJ; Ju, BK; Choi, WB; Jeong, JW; Lee, YH; Jang, J; Lee, KB; Oh, MH
1999Vacuum packaging using anodic bonding and emission characteristics of FEDLee, DJ; Ju, BK; Jeong, JW; Kim, H; Jung, SJ; Jang, J; Oh, MH
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