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Showing results 3 to 6 of 6

Issue DateTitleAuthor(s)
2012-11-05Fatigue-Free, Electrically Reliable Copper Electrode with Nanohole ArrayKim, Byoung-Joon; Cho, Yigil; Jung, Min-Suk; Shin, Hae-A-Seul; Moon, Myoung-Woon; Han, Heung Nam; Nam, Ki Tae; Joo, Young-Chang; Choi, In-Suk
2014-03-28Improving mechanical fatigue resistance by optimizing the nanoporous structure of inkjet-printed Ag electrodes for flexible devicesKim, Byoung-Joon; Haas, Thomas; Friederich, Andreas; Lee, Ji-Hoon; Nam, Dae-Hyun; Binder, Joachim R.; Bauer, Werner; Choi, In-Suk; Joo, Young-Chang; Gruber, Patric A.; Kraft, Oliver
2012-04Microstructure Evolution and Defect Formation in Cu Through-Silicon Vias (TSVs) During Thermal AnnealingShin, Hae-A-Seul; Kim, Byoung-Joon; Kim, Ju-Heon; Hwang, Sung-Hwan; Budiman, Arief Suriadi; Son, Ho-Young; Byun, Kwang-Yoo; Tamura, Nobumichi; Kunz, Martin; Kim, Dong-Ik; Joo, Young-Chang
2018-07Reliability Issues and Solutions in Flexible Electronics Under Mechanical FatigueYi, Seol-Min; Choi, In-Suk; Kim, Byoung-Joon; Joo, Young-Chang
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