Showing results 6 to 8 of 8
Issue Date | Title | Author(s) |
---|---|---|
2001-03 | Improvement of the reliability of a Cu/W-N/SiOF multilevel interconnect by inserting plasma enhanced chemical vapor deposited W-N thin film | Kim, DJ; Sim, HS; Lee, S; Kim, YT; Kim, SI; Park, JW |
2003-08 | Metal oxide semiconductor field effect transistor characteristics with iridium gate electrode on atomic layer deposited ZrO2 high-k dielectrics | Youm, M; Sim, HS; Jeon, H; Kim, SI; Kim, YT |
2003-07 | Method to enhance atomic-layer deposition of tungsten-nitride diffusion barrier for Cu interconnect | Sim, HS; Kim, SI; Kim, YT |