Browsing byAuthorPark, GS

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Showing results 4 to 4 of 4

Issue DateTitleAuthor(s)
2005-08Low-temperature silicon wafer-scale thermocompression bonding using electroplated gold layers in hermetic packagingPark, GS; Kim, YK; Paek, KK; Kim, JS; Lee, JH; Ju, BK

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