Showing results 5 to 6 of 6
Issue Date | Title | Author(s) |
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2012-04 | Microstructure Evolution and Defect Formation in Cu Through-Silicon Vias (TSVs) During Thermal Annealing | Shin, Hae-A-Seul; Kim, Byoung-Joon; Kim, Ju-Heon; Hwang, Sung-Hwan; Budiman, Arief Suriadi; Son, Ho-Young; Byun, Kwang-Yoo; Tamura, Nobumichi; Kunz, Martin; Kim, Dong-Ik; Joo, Young-Chang |
2018-07 | Reliability Issues and Solutions in Flexible Electronics Under Mechanical Fatigue | Yi, Seol-Min; Choi, In-Suk; Kim, Byoung-Joon; Joo, Young-Chang |