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Showing results 9 to 12 of 12

Issue DateTitleAuthor(s)
1999-05N2+ implantation approaches for improving thermal stability of Cu/Mo/Si contact structureKim, Y.T.; Kim, D.J.; Park, J.-W.
1991-01New insights on the effect of hydrogen to tungsten hexafluoride partial pressure ratio on plasma deposited tungsten thin filmsKim, Y.T.; Hong, J.S.; Min, S.-K.
2015-05Special memory mechanisms in SOI devicesCristoloveanu, S.; Bawedin, M.; Navarro, C.; Chang, S.-J.; Wan, J.; Andrieu, F.; Le, Royer C.; Rodriguez, N.; Gamiz, F.; Zaslavsky, A.; Kim, Y.T.
1992-01The effect of diluent gas and rapid thermal annealing on the properties of plasma-deposited silicon nitride filmsNam, C.W.; Woo, S.I.; Kim, Y.T.; Min, S.-K.
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