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Showing results 65 to 68 of 68

Issue DateTitleAuthor(s)
-Ultra-Thin Body Ge(110)-OI on Si fabrication from Ge/AlAs/GaAs Substrate via wafer bonding technologyShim Jae Phil; KIM HANSUNG; Ju, Gunwu; Hyeong rak Lim; Kim Seong Kwang; Jae-Hoon Han; Sanghyeon Kim; Kim Hyung-jun
-Wafer Bonging Process for III-V MOSFET and Monolithic 3D Integration on Si SubstratesKim Hyung-jun; Sanghyeon Kim
-(Undefined)Shin Jaekyun; Ahn, Jae Pyoung; Chang, Joonyeon; Kim Hyung-jun
-(Undefined)Kim Hyeon Seung; Kim Hyung-jun; Jun Woo Choi; 김경호; Han, Suk Hee
123

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