Browsing bySubjectDeep reactive-ion etching

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Issue DateTitleAuthor(s)
2020-08Low-temperature smoothing method of scalloped DRIE trench by post-dry etching process based on SF6 plasmaPark, J.S.; Kang, D.-H.; Kwak, S.M.; Kim, T.S.; Park, J.H.; Kim, T.G.; Baek, S.-H.; Lee, B.C.

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