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Issue Date | Title | Author(s) |
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2020-08 | Low-temperature smoothing method of scalloped DRIE trench by post-dry etching process based on SF6 plasma | Park, J.S.; Kang, D.-H.; Kwak, S.M.; Kim, T.S.; Park, J.H.; Kim, T.G.; Baek, S.-H.; Lee, B.C. |