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Showing results 1 to 6 of 6

Issue DateTitleAuthor(s)
2007-10Acceleration effect of CuCN in Ag electroplating for ultralarge-scale interconnectsCho, Sung Ki; Lee, Jong Kyun; Kim, Soo-Kil; Kim, Jae Jeong
1998-08-10Effects of precipitate distribution on electromigration in Al-Cu thin-film interconnectsHan, JH; Shin, MC; Kang, SH; Morris, JW
2022-05Heat dissipation of underlying multilayered graphene layers grown on Cu-Ni alloys for high-performance interconnects정민희; 노호균; 박미나; 김동영; 이현정; 김태욱; 배수강; 이상현
2007-03Improved electromigration failure in Al based interconnectsKim, Yong Tae; Kim, Seong-Il
-Investigation into the Cu addition effect in the 23Cr ferritic stainless steel for SOFC interconnectKim Byung Kyu; Kim, Dong-Ik; SHIM, JAE-HYEOK; Jung, Woo Sang; Kyung-Woo Yi; Sook In Kwun
-Microstructural analysis of oxide layer formation of ferritic stainless steel interconnectHong Seung Hee; Heung Nam Han; Phaniraj Madakashira; Kim, Dong-Ik; Ahn, Jae Pyoung; Cho, Young Whan
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