Browsing byAuthorD. J. Kim

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Showing results 1 to 7 of 7

Issue DateTitleAuthor(s)
1994-01Annealing effects on the properties of TiW/WNx bilayer.김용태; D. J. Kim; C. S. Kwon; J. W. Park; 민석기
1995-01New concept for amorphous diffusion barrier: Ion beam modification of metal/semiconductor interface.Kim Yong Tae; S. K. Kwak; C. S. Kwon; D. J. Kim; C. W. Lee; I. H. Choi; Min Suk-Ki
1996-01Nitrogen effects of Ta-Si-N diffusion barrier in Si/Cu metallization.Kim Yong Tae; S. P. Jeong; D. J. Kim; J. W. Park; Min Suk-Ki
1994-01Nitrogen implanted tungsten thin films for Cu diffusion barrier.Kim Yong Tae; D. J. Kim; C. S. Kwon; I. H. Choi; Min Suk-Ki
1996-01Study of temperature dependent conductivity of Ta, Ta-Si-N thin films.Kim Yong Tae; S. P. Jeong; D. J. Kim; H. N. Lee; Min Suk-Ki
-The properties of nitrogen implanted tungsten diffusion barrier for Cu metallization.Kim Yong Tae; C. S. Kwon; D. J. Kim; J. Y. Lee; I. H. Choi
1995-01The properties of nitrogen implanted tungsten diffusion barrier for Cu metallization.김용태; C. S. Kwon; D. J. Kim; J. Y. Lee; I. H. Choi

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