Browsing byAuthorKing, William P.

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Showing results 1 to 3 of 3

Issue DateTitleAuthor(s)
2020-02-18A composite phase change material thermal buffer based on porous metal foam and low-melting-temperature metal alloyYang, Tianyu; Kang, Jin Gu; Weisensee, Patricia B.; Kwon, Beomjin; Braun, Paul, V; Miljkovic, Nenad; King, William P.
2019-12An Integrated Liquid Metal Thermal Switch for Active Thermal Management of ElectronicsYang, Tianyu; Foulkes, Thomas; Kwon, Beomjin; Kang, Jin Gu; Braun, Paul V.; King, William P.; Miljkovic, Nenad
2023-02Responsive materials and mechanisms as thermal safety systems for skin-interfaced electronic devicesYoo, Seonggwang; Yang, Tianyu; Park, Minsu; Jeong, Hyoyoung; Lee, Young Joong; Cho, Donghwi; Kim, Joohee; Kwak, Sung Soo; Shin, Jaeho; Park, Yoonseok; Wang, Yue; Miljkovic, Nenad; King, William P.; Rogers, John A.

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