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Issue DateTitleAuthor(s)
1997-08New packaging method of field emission display using silicon-to-ITO coated glass bondingJeong, Jee-Won; Ju, Byeong-Kwon; Choi, Woo-Beom; Lee, Duck-Jung; Lee, Yun-Hi; Lee, Nam-Yang; Jung, Seong-Jae; Choi, Doo-Jin; Oh, Myung-Hwan
1

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