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Showing results 8 to 13 of 13

Issue Date	Title	Author(s)
2003-06-06	Innovation ultra thin packaging for RF-MEMS devices	Park, Y.-K.; Kim, Y.-K.; Kim, C.-J.; Ju, B.-K.; Park, J.-O.
1997-03	Modified low-temperature direct bonding method for vacuum microelectronics application	Ju, B.-K.; Lee, D.-J.; Choi, W.-B.; Lee, Y.-H.; Jang, J.; Lee, K.-B.; Oh, M.-H.
2021-11	Near-Infrared Self-Powered Linearly Polarized Photodetection and Digital Incoherent Holography Using WSe2/ReSe2van der Waals Heterostructure	Ahn, J.; Ko, K.; Kyhm, J.-H.; Ra, H.-S.; Bae, H.; Hong, S.; Kim, D.-Y.; Jang, J.; Kim, T.W.; Choi, S.; Kang, J.-H.; Kwon, N.; Park, S.; Ju, B.-K.; Poon, T.-C.; Park, M.-C.; Im, S.; Hwang, D.K.
2003-01	Surface-micromachined flexible polysilicon sensor array	Hwang, E.-S.; Kim, Y.-J.; Ju, B.-K.
2022-02	Terahertz imaging with metamaterials for biological applications	ROH, YE EUN; Lee, S.-H.; Jisung Kwak; Hyun, Seok Song; Shin, Seul gi; Kim, Yun Kyung; Wu, J.W.; Ju, B.-K.; Kang, B.; SEO, MIN AH
1997-03	The application of a plastic diaphragm for a silicon micropump	Kang, I.-B.; Son, M.-T.; Haskard, M.R.; Samaan, N.; Ju, B.-K.

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