Showing results 4 to 7 of 7
Issue Date | Title | Author(s) |
---|---|---|
1994-07-01 | INTERFACE AND ELECTRICAL-PROPERTIES OF PLASMA-DEPOSITED TUNGSTEN AND TUNGSTEN NITRIDE SCHOTTKY CONTACTS TO GAAS | KIM, YT; LEE, CW |
1992-08-03 | NEW METHOD TO IMPROVE THE ADHESION STRENGTH OF TUNGSTEN THIN-FILM ON SILICON BY W2N GLUE LAYER | KIM, YT; LEE, CW; MIN, SK |
1994-01 | NEW METHOD TO IMPROVE THERMAL-STABILITY IN THE INTERFACE OF SILICON AND TUNGSTEN BY THE INTERPOSITION OF PLASMA-DEPOSITED TUNGSTEN NITRIDE THIN-FILM | LEE, CW; KIM, YT; LEE, JY |
1994 | TEM STUDIES OF PLASMA-DEPOSITED TUNGSTEN AND TUNGSTEN NITRIDE BARRIERS FOR THERMALLY STABLE METALLIZATION | LEE, CW; KIM, YT; MIN, SK; LEE, C; LEE, JY; PARK, TW |