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Showing results 5 to 7 of 7

Issue DateTitleAuthor(s)
1992-08-03NEW METHOD TO IMPROVE THE ADHESION STRENGTH OF TUNGSTEN THIN-FILM ON SILICON BY W2N GLUE LAYERKIM, YT; LEE, CW; MIN, SK
1994-01NEW METHOD TO IMPROVE THERMAL-STABILITY IN THE INTERFACE OF SILICON AND TUNGSTEN BY THE INTERPOSITION OF PLASMA-DEPOSITED TUNGSTEN NITRIDE THIN-FILMLEE, CW; KIM, YT; LEE, JY
1994TEM STUDIES OF PLASMA-DEPOSITED TUNGSTEN AND TUNGSTEN NITRIDE BARRIERS FOR THERMALLY STABLE METALLIZATIONLEE, CW; KIM, YT; MIN, SK; LEE, C; LEE, JY; PARK, TW
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