Showing results 18 to 24 of 24
Issue Date | Title | Author(s) |
---|---|---|
- | Packaging of the MEMS devices using thin silicon wafer | 박윤권; 김용국; Kim Hun; LEE YUN HI; 김철주; Ju Byeong Kwon |
- | Packaging of the RF-MEMS switch | 박흥우; 이덕중; 박윤권; 김철주; PARK JEONG HO; 서용교; 김정우; SONG CI MOO; OH MYUNG HWAN; Ju Byeong Kwon |
- | Si micromachining for MEMS-IR sensor application | 박흥우; Ju Byeong Kwon; 박윤권; PARK JEONG HO; 김철주; Sang-Seop Yom; SUH SANG HEE; OH MYUNG HWAN |
1998-10 | Si micromachining for MEMS-IR sensor application | 박흥우; 주병권; 박윤권; 박정호; 김철주; 염상섭; 서상희; 오명환 |
- | SOI 웨이퍼를 이용한 압전박막 공진기의 설계 및 제작 | KIM IN TAY; 박윤권; 이시형; LEE YUN HI; Lee Jeon Kook; 김남수; Ju Byeong Kwon |
- | Wafer level sealing technology of MEMS devices using B-stage epoxy | 박흥우; 박윤권; 이덕중; 김철주; PARK JEONG HO; 서용교; 김정우; SONG CI MOO; OH MYUNG HWAN; Ju Byeong Kwon |
- | (Undefined) | 박윤권; Ju Byeong Kwon; 박흥우; Yoon Young Soo; Oh Young-Jei; PARK JEONG HO; SUH SANG HEE; OH MYUNG HWAN; 김철주 |