Showing results 23 to 24 of 24
Issue Date | Title | Author(s) |
---|---|---|
- | Wafer level sealing technology of MEMS devices using B-stage epoxy | 박흥우; 박윤권; 이덕중; 김철주; PARK JEONG HO; 서용교; 김정우; SONG CI MOO; OH MYUNG HWAN; Ju Byeong Kwon |
- | (Undefined) | 박윤권; Ju Byeong Kwon; 박흥우; Yoon Young Soo; Oh Young-Jei; PARK JEONG HO; SUH SANG HEE; OH MYUNG HWAN; 김철주 |