| - | A method of improving dielectric constant and adhesion strength of methysilsesquioxyane by using a NH3 plasma treatment | 심현상; Kim Yong Tae; 김동준; 전형탁; 추상현; 차국현 |
| - | Characteristic of tungsten nitride atomic layer deposition | 심현상; Kim Yong Tae; 전형탁 |
| - | Characteristics of pulse plasma enhanced atomic layer deposition of tungsten nitride diffusion barrier for copper interconnect | 심현상; Kim Yong Tae; 전형탁 |
| - | Characteristics of pulse plasma enhanced atomic layer deposition of tungsten nitride diffusion barrier for copper interconnect. | Kim Yong Tae; 심현상 |
| - | Characteristics of W-N diffusion barrier by atomic layer chemical vapor deposition | 심현상; Kim Yong Tae; 전형탁 |
| - | Correlation between surface modification of HSQ films and phase transformation of Cu/W-N bilayers deposition on the NH3 plasma treated HSQ films | 김동준; 심현상; 박종완; Kim Yong Tae; Kim Seong Il; KIM CHUN KEUN |
| - | DI-WeM8 characteristics of tungsten nitride atomic layer deposition | 심현상; Kim Yong Tae; H. Jeon |
| - | Digital deposition of tungsten nitride thin layer by cyclic exposure of WF//6 and NH₃ | 심현상; 김동준; Kim Yong Tae; 전형탁; PARK YOUNG KYUN; Kim Seong Il |
| - | Digital deposition of tungsten nitride thin layer by sequential exposure of tung sten hexafluoride and ammonia | 심현상; 김동준; Kim Yong Tae; 전형탁 |
| - | Effect of NH3 plasma treatment on improvement of reliability of W-B-N/HSQ thin films | 김동준; 심현상; Kim Yong Tae; 박종완 |
| - | Electrical characteristics of Ir/atomic layer deposited ZrO ₂ /Si field effect transistors | 심현상; 심선일; Kim Yong Tae |
| - | Enhancement of the electical and physical properties of Cu/W-N/HSQ interconnection scheme by NH₃ plasma treatment | 김동준; 심현상; Kim Yong Tae; KIM CHUN KEUN; 박종완 |
| - | Improvement in diffusion barrier properties of PECVD W-N thin film by low energy BF2+ implantation | 김동준; Kim Yong Tae; PARK YOUNG KYUN; 심현상; 박종완 |
| - | Improvement in the characteristics of ammonia plasma treated MSQ(Methyl Silsesquioxane) | 심현상; 김동준; KIM CHUN KEUN; Kim Seong Il; Kim Yong Tae; 전형탁 |
| - | Structural and micromechanical characteristics of low-dielectric organosilicate thin films modified by NH₃ plasma treatment | 차국헌; 주상현; 김수한; 심현상; Kim Yong Tae; 한진희; 이진규; 윤도영 |
| 2004-10-26 | 펄스 플라즈마 방전에 의한 박막 증착방법 | 김용태; 심현상; 이창우; 김성일 |
