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Showing results 4 to 9 of 9

Issue DateTitleAuthor(s)
-Glass-to glass wafer anodic bonding and its application to FEA/FED micro-packagingJu Byeong Kwon; 이덕중; 정지원; OH MYUNG HWAN; 정성재; LEE NAM YANG; 고영욱; LEE CHOONG HOON; 한정인; 조경익; CHOI DOO JIN
-Glass-to-glass bonding for tubeless packaging of field emission displayJu Byeong Kwon; 최우범; 이덕중; 정지원; 정성재; LEE NAM YANG; 조경익; 유형준; 한정인; OH MYUNG HWAN
1998-08Improvement of bonding properties by pre-bonding at room temperature in Si-glass electrostatic bonding process주병권; 이덕중; 이윤희; 이남양; 한정인; 조경익; 오명환
-In-situ vacuum packaging method for FEDs in ultra-high-vacuum chamber최우범; Ju Byeong Kwon; LEE YUN HI; 정지원; OH MYUNG HWAN; 정성재; LEE NAM YANG; 한정인; 조경익; 성만영
-Technical improvement of FED tubeless packagingJu Byeong Kwon; 이덕중; 최우범; 정성재; LEE NAM YANG; 조경익; LEE YUN HI; 성만영; OH MYUNG HWAN
-Vacuum sealing of field-emission arrays using field-assisted bonding method이덕중; Ju Byeong Kwon; LEE YUN HI; OH MYUNG HWAN; LEE NAM YANG; 한정인; 조경익; 장진
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