Showing results 1 to 4 of 4
Issue Date | Title | Author(s) |
---|---|---|
2002-05 | Flexible module packaging using MEMS technology | 황은수; 최석문; 주병권, et al |
2004-03 | Flexible polysilicon sensor array modules using | 황은수; 김용준; 주병권 |
2003-05 | Flexible polysilicon sensor array modules using "Etch-Release" Packaging Scheme | 황은수; 김용준; 주병권 |
2003-01 | Surface-micromachined flexible polysilicon sensor array. | 황은수; 김용준; 주병권 |