Showing results 5 to 10 of 10
Issue Date | Title | Author(s) |
---|---|---|
- | PDP tubeless packaging by using epoxy gluing process at room temperature | Seung-Il Moon; Duck-Jung Lee; OH MYUNG HWAN; LEE YUN HI; Ju Byeong Kwon; Young-Cho Kim; Gwon-Jin Moon; Jun-Dong Kim |
- | PDP tubeless packaging using B-stage epoxy | Seung-Il Moon; Duck-Jung Lee; OH MYUNG HWAN; LEE YUN HI; Ju Byeong Kwon; Young-Cho Kim; Gwon-Jin Moon; Jun-Dong Kim |
- | RF-MEMS package with vertical via hole for low loss characteristic | Yun-Kwon Park; Heung-Woo Park; Duck-Jung Lee; Jung-Ho Park; Chung-Woo Kim; Ci-Moo Song; Chul-Ju Kim; Ju Byeong Kwon |
- | Thin PDP packaging technology by direct-joint method | Duck-Jung Lee; Ju Byeong Kwon; LEE YUN HI; Yun-Kwon Park; Jun-Dong Kim; Gwon-Jin Moon; Jin Jang; OH MYUNG HWAN |
- | Vacuum in-line packaging and characterization of the surface-micromachined vacuum magnetic field sensors | Heung-Woo Park; Yun-Kwon Park; Duck-Jung Lee; Chul-Ju Kim; Jung-Ho Park; OH MYUNG HWAN; Ju Byeong Kwon |
- | Vacuum in-line packaging technology of AC-PDP using direct-joint method | Duck-Jung Lee; Seung-Il Moon; LEE YUN HI; Ju Byeong Kwon; Jun-Dong Kim; Gwon-Jin Moon; Jin Jang |