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Showing results 5 to 10 of 10

Issue DateTitleAuthor(s)
-PDP tubeless packaging by using epoxy gluing process at room temperatureSeung-Il Moon; Duck-Jung Lee; OH MYUNG HWAN; LEE YUN HI; Ju Byeong Kwon; Young-Cho Kim; Gwon-Jin Moon; Jun-Dong Kim
-PDP tubeless packaging using B-stage epoxySeung-Il Moon; Duck-Jung Lee; OH MYUNG HWAN; LEE YUN HI; Ju Byeong Kwon; Young-Cho Kim; Gwon-Jin Moon; Jun-Dong Kim
-RF-MEMS package with vertical via hole for low loss characteristicYun-Kwon Park; Heung-Woo Park; Duck-Jung Lee; Jung-Ho Park; Chung-Woo Kim; Ci-Moo Song; Chul-Ju Kim; Ju Byeong Kwon
-Thin PDP packaging technology by direct-joint methodDuck-Jung Lee; Ju Byeong Kwon; LEE YUN HI; Yun-Kwon Park; Jun-Dong Kim; Gwon-Jin Moon; Jin Jang; OH MYUNG HWAN
-Vacuum in-line packaging and characterization of the surface-micromachined vacuum magnetic field sensorsHeung-Woo Park; Yun-Kwon Park; Duck-Jung Lee; Chul-Ju Kim; Jung-Ho Park; OH MYUNG HWAN; Ju Byeong Kwon
-Vacuum in-line packaging technology of AC-PDP using direct-joint methodDuck-Jung Lee; Seung-Il Moon; LEE YUN HI; Ju Byeong Kwon; Jun-Dong Kim; Gwon-Jin Moon; Jin Jang
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