Browsing by Author 박길수

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Showing results 1 to 2 of 2

Issue DateTitleAuthor(s)
2005-08Low-Temperature Silicon Wafer-Scale Thermocompression Bonding Using Electroplated Gold Layers in Hermetic Packaging박길수; 김용국; 백경갑, et al
2006-03Thermocompression bonding for wafer level hermetic packaging of RF-MEMS devices박길수; 서상원; 최우범, et al

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