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Showing results 1 to 3 of 3

Issue DateTitleAuthor(s)
2002-04A novel wafer level packaging of the RF-MEMS devices with low loss박윤권; 이덕중; 박흥우, et al
2001-04Packaging of the RF-MEMS switch박흥우; 이덕중; 박윤권, et al
2001-04Wafer level sealing technology of MEMS devices using B-stage epoxy박흥우; 박윤권; 이덕중, et al

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