Browsing by Author 이덕중

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Showing results 1 to 30 of 68

Issue DateTitleAuthor(s)
2003-01A novel thin chip scale packaging of the RF-MEMS devices using ultra thin silicon.박윤권; 김용국; 김훈, et al
2002-04A novel wafer level packaging of the RF-MEMS devices with low loss박윤권; 이덕중; 박흥우, et al
2000-04A tubeless AC-plasma display panel(PDP) packaged by electrostatic bonding technology이덕중; 주병권; 정진욱, et al
2000-06Application of electrostatic bonding to field emission display vacuum packaging이덕중; 이남양; 정성재, et al
2002-04Development of flat type back-lamp using carbon nano tubes grown on glass substrate이양두; 이덕중; 박정훈, et al
2002-04Development of flat type back-lamp using carbon nano tubes grown on glass substrate이양두; 이덕중; 박정훈, et al
2002-05Development of in-line sealing method for plasma display panel이덕중; 이윤희; 주병권, et al
2000-05Development of spacer formation method using anodic bonding technique for field emission display강문식; 장윤택; 이덕중, et al
1999-04Development of tubeless-packaged field emission display주병권; 이덕중; 이윤희, et al
1998-07Electrostatic bonding between two ITO-coated glass for FED tubeless packaging applications주병권; 이덕중; 정지원, et al
1998-11Electrostatic bonding of silicon-to-ITO coated #7059 glass using Li-doped oxide interlayer정지원; 주병권; 이덕중, et al
2000-12Electrostatically vacuum sealed tunneling magnetic sensors박흥우; 주병권; 이덕중, et al
2003-06Evaluation of carbon nanotubes as gas sensing materials micro gas sensors.문승일; 이덕중; 장윤택, et al
2001-09Fabrication and packaging of the vacuum magnetic field sensor박흥우; 박윤권; 이덕중, et al
1998-08Fabrication of Si, Mo tip FEAs and FED application주병권; 이상조; 김훈, et al
1998-11FED Tubeless packaging by vacuum-electrostatic bonding주병권; 이덕중; 정지원, et al
1999-04FED의 실장 공정 시 진공 효율 향상에 관한 연구이덕중; 주병권; 이윤희, et al
2002-12Flat lamp fabrication using CNTs grown on glass substrate이양두; 이덕중; 이윤희, et al
2002-12Flat lamp fabrication using CNTs grown on glass substrate이양두; 이덕중; 이윤희, et al
1998-09Glass-to glass wafer anodic bonding and its application to FEA/FED micro-packaging주병권; 이덕중; 정지원, et al
2000-01Glass-to-glass anodic bonding for high vacuum packaging of microelectronics and its stability이덕중; 주병권; 장진, et al
1997-01Glass-to-glass bonding for tubeless packaging of field emission display주병권; 최우범; 이덕중, et al
1998-08Improvement of bonding properties by pre-bonding at room temperature in Si-glass electrostatic bonding process주병권; 이덕중; 이윤희, et al
2002-11Low temperature sealing of plasma display panel using organic material문승일; 이덕중; 김영조, et al
1997-03Modified low-temperature direct bonding method for vacuum microelectronics application주병권; 이덕중; 최우범, et al
1997-04Modified low-temperature direct bonding method for vacuum microelectronics application주병권; 이덕중; 최우범, et al
1997-01Multi-substrate bonding using anodic bonding method주병권; 이덕중; 최우범, et al
1997-01New packaging method of field emission display using silicon-to-ITO coated glass bonding정지원; 주병권; 최우범, et al
2000-05New vacuum packaging using wire-heater and optical fiber spacer for FED이덕중; 주병권; 오명환, et al
1999-01Novel bonding technology for hermetically sealed silicon micropackage.이덕중; 주병권; 최우범, et al

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