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Showing results 1 to 10 of 10

Issue DateTitleAuthor(s)
2002-01Electron emission characteristics of the porous polycrystalline silicon diode김훈; Jong-Won Park; 이주원, et al
1998-05Electrostatic bonding between Si and ITO-coated #7059 glass substrates주병권; 정회환; 김영조, et al
1998-07Electrostatic bonding between two ITO-coated glass for FED tubeless packaging applications주병권; 이덕중; 정지원, et al
1998-09Glass-to glass wafer anodic bonding and its application to FEA/FED micro-packaging주병권; 이덕중; 정지원, et al
1997-01Glass-to-glass bonding for tubeless packaging of field emission display주병권; 최우범; 이덕중, et al
1998-11Glass-to-glass electrostatic bonding for FED tubeless packaging application주병권; 최우범; 이윤희, et al
1998-08Improvement of bonding properties by pre-bonding at room temperature in Si-glass electrostatic bonding process주병권; 이덕중; 이윤희, et al
1998-05In-situ vacuum packaging method for FEDs in ultra-high-vacuum chamber최우범; 주병권; 이윤희, et al
1999-07Technical improvement of FED tubeless packaging주병권; 이덕중; 최우범, et al
1998-05Vacuum sealing of field-emission arrays using field-assisted bonding method이덕중; 주병권; 이윤희, et al