| 1996-01-01 | A micromechanical analysis of interfacial adhesion strength and film hardness for elastic thin films on plastic substrates | Jeong, Jeung hyun |
| 2001-01-01 | An analytical model for intrinsic stress effect on out-of-plane deflection of a chemical vapor deposited thick films | Jeong, Jeung hyun |
| 1999-01-01 | Analysis of reliability of thin-film materials for microelectronic components | Jeong, Jeung hyun |
| 2000-01-01 | CVD 다이아몬드 웨이퍼의 역학적 신뢰성에 미치는 잔류응력 평가연구 | Jeong, Jeung hyun |
| 2001-01-01 | CVD 다이아몬드 후막의 면외 변형에 미치는 잔류응력의 영향 | Jeong, Jeung hyun |
| 1996-01-01 | Determination of adhesion strength of hard thin film on ductile substrate through film cracking technique | Jeong, Jeung hyun |
| 2000-01-01 | Determination of critical interfacial energy release rate in hard coatings on ductile substrate | Jeong, Jeung hyun |
| 1996-01-01 | DLC 박막의 기계적 성질 평가 | Jeong, Jeung hyun |
| 1996-01-01 | Estimation of interfacial adhesion through the micromechanical analysis of failure mechanisms in DLC film | Jeong, Jeung hyun |
| 2000-01-01 | Evaluation of residual stress in diamond film through advanced analytic model for substrate curvature method | Jeong, Jeung hyun |
| 2000-01-01 | Micro-scaling effect on yield strength of thin films | Jeong, Jeung hyun |
| 1997-01-01 | Micromechanical analysis of adhesion strength for a brittle film coated substrate | Jeong, Jeung hyun |
| 1999-01-01 | Micromechanical analysis of residual stress effect in CVD-processed diamond wafer | Lee, Wook Seong; Jeong, Jeung hyun |
| 1996-01-01 | Quantitative evaluation of interface adhesion in DLC film/metal system through the analysis | Jeong, Jeung hyun |
| 2022-07 | Transparent back-junction control in Cu(In,Ga)Se2 absorber for high-efficiency, color-neutral, and semitransparent solar module | Jeong, Ahrum; Choi JaeMyeong; Lee Hyunjae; Kim, Gee Yeong; PARK, JONG KEUK; KIM, WON MOK; Kuk, S.; Wang, Z.; Hwang, D.J.; Yu, Hyeong geun; Jeong, Jeung hyun |
| 2000-01-01 | 금속간화합물 분석을 통한 Sn-Ag 솔더 접합부의 미세파괴특성 평가 | Jeong, Jeung hyun |
| 1996-01-01 | 반도체 칩 재료의 미세파괴기구 해석 및 신뢰성 평가 연구 | Jeong, Jeung hyun |
| 1997-01-01 | 소재의 국부파괴인성 평가기법 개발 | Jeong, Jeung hyun |
| 2002-01-01 | 초소형기계시스템의 공진특성 분석을 통한 박막의 기계적특성 평가 | Jeong, Jeung hyun |
| 1995-01-01 | 탄성박막층의 다중균열현상 분석에 의한 계면전단강도의 평가 | Jeong, Jeung hyun |
