| 1999-06 | A method of determining the elastic properties of diamond-like carbon films | Cho, SJ; Lee, KR; Eun, KY; Jeong, JH; Kwon, D |
| 2003-09 | A new indentation cracking method for evaluating interfacial adhesion energy of hard films | Kim, JJ; Jeong, JH; Lee, KR; Kwon, D |
| 2004-10-01 | Analysis of interfacial strengthening from composite hardness of TiN/VN and TiN/NbN multilayer hard coatings | Kim, SH; Baik, YJ; Kwon, D |
| 2002-05-15 | Analytical model for intrinsic residual stress effects and out-of-plane deflections in free-standing thick films | Jeong, JH; Kwon, D; Baik, YJ |
| 2003-04-10 | Determination of stress-strain curve for microelectronic solder joint by ESPI measurement and FE analysis | Lee, BW; Jeong, JH; Jang, W; Kim, JY; Kim, DW; Kwon, D; Nah, JW; Paik, KW |
| 2001-08 | Intrinsic stress in chemical vapor deposited diamond films: An analytical model for the plastic deformation of the Si substrate | Jeong, J; Kwon, D; Lee, WS; Baik, YJ |
| 2002-08 | Mechanical analysis for crack-free release of chemical-vapor-deposited diamond wafers | Jeong, JH; Lee, SY; Lee, Wook Seong; Baik, Young Joon; Kwon, D |
