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Showing results 1 to 3 of 3

Issue DateTitleAuthor(s)
-A new atomic layer deposition method and electrical performance of WN diffusion barrier for Cu nano via contact structuresKim, Young-Hwan; Yeong-Hyeon Hwang; Won-Ju Cho; Kim, Yong Tae
-Comparison of thin film properties of WN diffusion barrier prepared by atomic layer deposition using metal organic and metal halide reactant gasesYeonghyeon Hwang; Won-Ju Cho; Kim, Yong Tae
-Thermal stability of Cu/WN/Si nano via contact structuresYeong Hyeon Hwang; Won-Ju Cho; Kim, Young-Hwan; Kim, Yong Tae
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