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Showing results 1 to 2 of 2

Issue DateTitleAuthor(s)
2001-11A method of improving dielectric constant and adhesion strength of methyl silsesquioxane by using a NH3 plasma treatment김용태
2002-06Effects of NH₃ plasma treatment on methyl silsequioxane for copper multi-level interconnect심현상; 김용태; 전형탁

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