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Showing results 1 to 3 of 3

Issue DateTitleAuthor(s)
-A method of improving dielectric constant and adhesion strength of methyl silsesquioxane by using a NH3 plasma treatmentKim Yong Tae
-Characteristics of pulse plasma enhanced atomic layer deposition of tungsten nitride diffusion barrier for copper interconnect.Kim Yong Tae; 심현상
-Characteristics of W-N diffusion barrier by atomic layer chemical vapor deposition심현상; Kim Yong Tae; 전형탁
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