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Showing results 1 to 2 of 2

Issue DateTitleAuthor(s)
2018-05Heterogeneous Integration Toward a Monolithic 3-D Chip Enabled by III-V and Ge MaterialsKim, Sang-Hyeon; Kim, Seong-Kwang; Shim, Jae-Phil; Geum, Dae-Myeong; Ju, Gunwu; Kim, Han-Sung; Lim, Hee-Jeong; Lim, Hyeong-Rak; Han, Jae-Hoon; Lee, Subin; Kim, Ho-Sung; Bidenko, Pavlo; Kang, Chang-Mo; Lee, Dong-Seon; Song, Jin-Dong; Choi, Won Jun; Kim, Hyung-Jun
2022-04TiOx/Ti/TiOx Tri-Layer Film-Based Waveguide Bolometric Detector for On-Chip Si Photonic SensorShim, Joonsup; Lim, Jinha; Geum, Dae-Myeong; You, Jong-Bum; Yoon, Hyeonho; Kim, Joon Pyo; Baek, Woo Jin; Han, Jae-Hoon; Kim, Sanghyeon
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