DSpace at KIST

Browsing bySubjectThrough-silicon via (TSV)

Jump to:
All A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
가 나 다 라 마 바 사 아 자 차 카 타 파 하
  • Sort by:
  • In order:
  • Results/Page
  • Authors/Record:

Showing results 1 to 1 of 1

Issue DateTitleAuthor(s)
2012-04Microstructure Evolution and Defect Formation in Cu Through-Silicon Vias (TSVs) During Thermal AnnealingShin, Hae-A-Seul; Kim, Byoung-Joon; Kim, Ju-Heon; Hwang, Sung-Hwan; Budiman, Arief Suriadi; Son, Ho-Young; Byun, Kwang-Yoo; Tamura, Nobumichi; Kunz, Martin; Kim, Dong-Ik; Joo, Young-Chang
1

BROWSE