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Showing results 1 to 4 of 4

Issue DateTitleAuthor(s)
2002-07Characteristics of pulse plasma enhanced atomic layer deposition of tungsten nitride diffusion barrier for copper interconnect.김용태; 심현상
1999-01Effects PECVD W-N diffusion barrier on thermal stress and electrical properties of Cu/W-N/SiOF multilevel interconnect김용태; 김동준; 이석형, et al
1999-01Improvement in diffusion barrier properties of PECVD W-N thin film by low energy BF2+ implantation김동준; 김용태; 박영균, et al
2001-03Improvement of the reliability of a Cu/W-N/SiOF Multilevel interconnect by inserting plasma enhanced chemical vapor deposited W-N thin film김동준; 심현상; 이세경, et al