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Issue DateTitleAuthor(s)
2021-01-26Hierarchical Porous Film with Layer-by-Layer Assembly of 2D Copper Nanosheets for Ultimate Electromagnetic Interference ShieldingChoi, Ho Kwang; Lee, Aram; Park, Mina; Lee, Dong Su; Bae, Sukang; Lee, Seoung-Ki; Lee, Sang Hyun; Lee, Takhee; Kim, Tae-Wook
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