| - | 3D 패키징 적용을 위한 박막 실리콘 기판을 이용한 RF-MEMS 패키징 . | 김용국; 박윤진; 김철주; Ju Byeong Kwon |
| 2023-08 | A Water-Resistant, Self-Healing Encapsulation Layer for a Stable, Implantable Wireless Antenna | An, Soojung; Lyu, Hyunsang; Seong, Duhwan; Yoon, Hyun; Kim, In Soo; Lee, Hyojin; Shin, Mikyung; Hwang, Keum Cheol; Son, Donghee |
| 2021-10-10 | Development of ecofriendly active food packaging materials based on blends of cross-linked poly (vinyl alcohol) and Piper betle Linn. leaf extract | Quynh Thi Phuong Bui; Thuong Thi Nguyen; Lam Thi Truc Nguyen; Kim, Sang Hoon; Hoa Ngoc Nguyen |
| 2004-03-01 | Flexible polysilicon sensor array modules using "etch-release" packaging scheme | Hwang, ES; Kim, YJ; Ju, BK |
| - | New Vacuum packaging method of field emission display | Ju Byeong Kwon; 최우범; S. J. Jeong; LEE NAM YANG; J. I. Han; K. I. Cho; OH MYUNG HWAN |
| 2020-12-15 | Oxygen barrier properties of polyketone/EVOH blend films and their resistance to moisture | Kim, Jihun; Oh, Seijin; Cho, Sung Min; Jun, Jaeho; Kwak, Soonjong |
| 2001-01 | PDP tubeless packaging process using glass-to-glass vacuum-electrostatic bonding | 주병권; 이덕중; 정진욱; 문권진; 김영조; 이윤희 |
| - | Thin PDP packaging by glass-bonding techonlogy and its driving properties | 이덕중; Ju Byeong Kwon; 정진욱; 박흥우; LEE YUN HI; 김영조; 조태성; 최은하; 장진; OH MYUNG HWAN |
| - | Vacuum in-line packaging and characterization of the surface-micromachined vacuum magnetic field sensors | Heung-Woo Park; Yun-Kwon Park; Duck-Jung Lee; Chul-Ju Kim; Jung-Ho Park; OH MYUNG HWAN; Ju Byeong Kwon |
| - | Vacuum in-line packaging technology of AC-PDP using direct-joint method | Duck-Jung Lee; Seung-Il Moon; LEE YUN HI; Ju Byeong Kwon; Jun-Dong Kim; Gwon-Jin Moon; Jin Jang |
