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Showing results 30 to 35 of 35

Issue DateTitleAuthor(s)
-Ultra-Thin Body Ge(110)-OI on Si fabrication from Ge/AlAs/GaAs Substrate via wafer bonding technologyShim Jae Phil; KIM HANSUNG; Ju, Gunwu; Hyeong rak Lim; Kim Seong Kwang; Jae-Hoon Han; Sanghyeon Kim; Kim Hyung-jun
2000-04Vacuum-electrostatic bonding properties of glass-to-glass substrates주병권; 이덕중; 이윤희
-Wafer Bonging Process for III-V MOSFET and Monolithic 3D Integration on Si SubstratesKim Hyung-jun; Sanghyeon Kim
-(Undefined)Ju Byeong Kwon; 강경두; 정수태; Jung Jae Hoon; 정귀상
-(Undefined)Ju Byeong Kwon; 강경두; 박진성; 정수태; 정귀상
-(Undefined)Ju Byeong Kwon; 김일명; 이승준; 강경두; 정수태; 정귀상
12

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