Showing results 1 to 3 of 3
Issue Date | Title | Author(s) |
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- | 3D 패키징 적용을 위한 박막 실리콘 기판을 이용한 RF-MEMS 패키징 . | 김용국; 박윤진; 김철주; Ju Byeong Kwon |
- | Design and fabrication of film bulk acoustic wave resonator | KIM IN TAY; 박윤권; 김용국; LEE YUN HI; Lee Jeon Kook; 김남수; Ju Byeong Kwon |
- | Fabrication of flexible FBAR using thin silicon wafer. | 김용국; 배용환; 강유리; Kim Jai Kyeong; KIM SOO WON; Ju Byeong Kwon |