Packaging of vacuum microelectronic device using electrostatic bonding

Title
Packaging of vacuum microelectronic device using electrostatic bonding
Authors
주병권이덕중오명환
Keywords
MEMS; FED; FEA
Issue Date
1998-11
Publisher
대한전기학회 추계학술대회
Citation
, ?-?
URI
http://pubs.kist.re.kr/handle/201004/10118
Appears in Collections:
KIST Publication > Conference Paper
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