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Packaging of vacuum microelectronic device using electrostatic bonding

Title
Packaging of vacuum microelectronic device using electrostatic bonding
Authors
주병권; 이덕중; 오명환
Keywords
MEMS; FED; FEA
Issue Date
1998-11
Publisher
대한전기학회 추계학술대회
Citation
, ?-?
URI
http://pubs.kist.re.kr/handle/201004/10118
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KIST Publication > Conference Paper
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