Flip chip bonder for automactic parallel aligning of IR sensors and read out integrated circuits

Title
Flip chip bonder for automactic parallel aligning of IR sensors and read out integrated circuits
Authors
서상희송종형안세영김진상
Keywords
자동 평행 배열
Issue Date
1999-11
Publisher
제 10 회 적외선 영상 센서 Conference
Citation
, 134-139
URI
http://pubs.kist.re.kr/handle/201004/10183
Appears in Collections:
KIST Publication > Conference Paper
Files in This Item:
There are no files associated with this item.
Export
RIS (EndNote)
XLS (Excel)
XML


qrcode

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

BROWSE