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Fabrication of 2-layer flexible copper clad laminate (FCCL) with high peel strength for chip on flex (COF)

Other Titles

COF용 고밀도 2층 FCCL제작

Authors

Choi, Hyoung Wook; 심광보; Park Dong Hee; 조정; CHOI, WON-KOOK

Citation

2007표면공학회 춘계 학술대회논문집, pp.7 - 8

Keywords

FCCL; COF; 고밀도; PI

URI

https://pubs.kist.re.kr/handle/201004/102974

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KIST Conference Paper > Others

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