Effects of leveler on the trench filling during damascene copper plating

Title
Effects of leveler on the trench filling during damascene copper plating
Authors
이유용박영준이재봉조병원
Keywords
electroplating; leveler; damascene; void; superfilling
Issue Date
2002-08
Publisher
Journal of the Korean Electrochemical Society; 전기화학회지
Citation
VOL 5, NO 3, 153-158
URI
http://pubs.kist.re.kr/handle/201004/10495
ISSN
1229-1935
Appears in Collections:
KIST Publication > Article
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