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dc.contributor.authorHeon Woong Choi-
dc.contributor.author문명운-
dc.contributor.authorKIm Tae Young-
dc.contributor.authorLee, Kwang Ryeol-
dc.contributor.authorKyu Hwan Oh-
dc.date.accessioned2024-01-13T10:32:48Z-
dc.date.available2024-01-13T10:32:48Z-
dc.date.created2021-09-29-
dc.identifier.issn0272-9172-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/105804-
dc.languageEnglish-
dc.subjectDLC-
dc.subjectthermal anneling-
dc.subjectresidual stress-
dc.titleThe Thermal Annealing Effect on the Residual Stress and Interface Adhesion in the Compressive Stressed DLC Film-
dc.typeConference-
dc.description.journalClass1-
dc.identifier.bibliographicCitationMaterials Research Society Symposium Proceedings, v.795, pp.U11.42.1(87) - U11.42.6(92)-
dc.citation.titleMaterials Research Society Symposium Proceedings-
dc.citation.volume795-
dc.citation.startPageU11.42.1(87)-
dc.citation.endPageU11.42.6(92)-
dc.citation.conferencePlaceUS-
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