Design of electrostatic bonding equipment for large area and the effect of contamination particle on the Si-glass electrostatic bonding.

Title
Design of electrostatic bonding equipment for large area and the effect of contamination particle on the Si-glass electrostatic bonding.
Authors
문제도오재열조영래정효수주병권오명환
Issue Date
1996-01
Publisher
한국재료학회지; Korean journal of materials research
Citation
VOL 6, NO 1, 3-11
URI
http://pubs.kist.re.kr/handle/201004/10586
Appears in Collections:
KIST Publication > Article
Files in This Item:
There are no files associated with this item.
Export
RIS (EndNote)
XLS (Excel)
XML


qrcode

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

BROWSE