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Flexible polysilicon sensor array modules using "Etch-Release" Packaging Scheme

Other Titles

Etch-release 패키징 방법을 이용한 flexible 폴리실리콘 센서 어레이 모듈

Authors

황은수; 김용준; Ju Byeong Kwon

Citation

한국 MEMS 학술대회, pp.40 - 45

Keywords

flexible packaging; sensor array; release-etching; piezoresistivity; strain gauge

URI

https://pubs.kist.re.kr/handle/201004/106310

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KIST Conference Paper > Others

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