DSpace at KISTKIST Conference PaperOthers

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dc.contributor.author김용국-
dc.contributor.author박윤진-
dc.contributor.author김철주-
dc.contributor.authorJu Byeong Kwon-
dc.date.accessioned2024-01-13T12:01:02Z-
dc.date.available2024-01-13T12:01:02Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/106488-
dc.languageEnglish-
dc.subjectRF MEMS-
dc.subjectthin wafer-
dc.subjectpackaging-
dc.title3D 패키징 적용을 위한 박막 실리콘 기판을 이용한 RF-MEMS 패키징 .-
dc.typeConference-
dc.description.journalClass2-
dc.identifier.bibliographicCitation제 10 회 반도체학술대회, pp.707 - 708-
dc.citation.title제 10 회 반도체학술대회-
dc.citation.startPage707-
dc.citation.endPage708-
dc.citation.conferencePlaceKO-
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