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Characteristics of pulse plasma enhanced atomic layer deposition of tungsten nitride diffusion barrier for copper interconnect

Authors

심현상; Kim Yong Tae; 전형탁

Citation

AVS Topical Conference on Atomic Layer Deposition, pp.67

Keywords

펄스플라즈마; 원자층증착; cu-interconnect; diffusion barrier기술

URI

https://pubs.kist.re.kr/handle/201004/106737

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KIST Conference Paper > Others

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