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dc.contributor.authorJi Young Park-
dc.contributor.authorChang-Ha Lee-
dc.contributor.authorLee Youn-Woo-
dc.contributor.authorLim Jong Sung-
dc.date.accessioned2024-01-13T13:03:35Z-
dc.date.available2024-01-13T13:03:35Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/107184-
dc.languageEnglish-
dc.subjectelectroplating-
dc.titleElectroplating of Ni on Cu in Ni-plating solution/scCO ₂ emulsion.-
dc.typeConference-
dc.description.journalClass1-
dc.identifier.bibliographicCitationSuper Green 2002, pp.328 - 331.-
dc.citation.titleSuper Green 2002-
dc.citation.startPage328-
dc.citation.endPage331.-
dc.citation.conferencePlaceKO-
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