Vacuum in-line packaging and characterization of the surface-micromachined vacuum magnetic field sensors

Authors
Heung-Woo ParkYun-Kwon ParkDuck-Jung LeeChul-Ju KimJung-Ho ParkOH MYUNG HWANJu Byeong Kwon
Citation
Proceedings of the International Sensor Conference 2001, pp.29 - 30.
Keywords
packaging
URI
https://pubs.kist.re.kr/handle/201004/107990
Appears in Collections:
KIST Conference Paper > Others
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