Heat transfer from an aluminum foam heat sink for electronics cooling

Authors
백진욱Kim Seo Young강병하
Citation
Proceedings of the 4th JSME-KSME Thermal Engineering Conference, pp.2 - 635-2-640
Keywords
aluminum foam
URI
https://pubs.kist.re.kr/handle/201004/108828
Appears in Collections:
KIST Conference Paper > Others
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